Film and flexible metal-clad laminate

ABSTRACT

A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

TECHNICAL FIELD

The present invention relates to a film and a flexible metal-cladlaminate comprising the film and a metal layer on the film, whichflexible metal-clad laminate is excellent in solderability aftermoisture absorption (post-moisture absorption solderability).

BACKGROUND ART

Recently electronic devices have been rapidly improved to have betterproperties, greater functionality, and smaller sizes. To cope with theimprovement of the electronic devices, electronic components to bemounted on the electronic devices have been facing increasing demands tobe smaller in size and lighter in weight. Accordingly, semiconductorelement packaging techniques and circuit boards to which semiconductorsare to be mounted are also required to be able to give greater density,functionality, and properties to the electronic devices.

Flexible printed circuit boards (hereinafter, may be referred to asFPCs) generally have such a structure that includes (i) a metal-cladlaminate on which a circuit pattern is formed, and (ii) a cover layer onthe circuit pattern. The metal-clad laminate includes a thin andflexible insulating film as a substrate (base film), and a metal foilbonded to the substrate via an adhesive of various kinds by thermalcompression bonding. In such three-layered flexible printed circuitboards (3-layered FPC) having three layers (insulating film, adhesivelayer, and metal foil), a polyimide films and the like are used as theinsulating film conventionally. This is because polyimide is excellentin heat resistance, electric properties, etc. As to the adhesive layer,thermally-curing adhesive agents of epoxy resin type, acrylic resintype, etc. are generally used.

In order to attain such an FPC greater in density, functionality, andproperties, the insulating adhesive agent and the insulating film usedas the components of the FPC should also be greater in properties. Morespecifically, the adhesive layer etc. are required to be high in heatresistance and mechanical strength, and further to be excellent inprocessability, adhesion, electric properties, and size stability and below in moisture absorption.

Regarding these points, the thermally-curing resins such as epoxy resin,acrylic resin used as the adhesive layer have such conventionaladvantages that they are excellent in low temperature processabilitywhich allows bonding at relatively low temperatures. Further, theconventional thermally-curing resins are highly economicalconventionally. However, the thermally-curing resins are insufficientconventionally in terms of the other properties such as heat resistanceetc. for example.

In order to solve the problem, a two-layer FPCs have been proposed inwhich an adhesive layer is also made of a polyimide material (see,Patent Literature 1, for example). Note that the FPCs whose adhesivelayer is made of a polyimide material may be regarded as a three-layeredFPC in a strict sense, but two polyimide layers are regarded as a singlelayer, thereby considering the FPCs of this type as being “two-layered”.The two-layered FPC, which is greater in heat resistance, electricproperties, and size stability than the three-layered FPCs whoseadhesive layer is made of epoxy resin or acryl resin, are expected ascomponents that can satisfy future demands in properties.

On the other hand, the use of a polyimide material is disadvantageouslyassociated with high water absorption coefficient due to properties ofpolyimide. The two-layered FPCs are also associated with this problem. AFPC with a high water absorption coefficient would adversely affectcomponent mounting process in which soldering is used. Morespecifically, moisture taken into the polyimide material from atmosphereis rapidly discharged from the polyimide material by heat applied duringthe component mounting process. This results in swelling or whitening ofthe FPC, and further leading to adhesion or electric property betweenmembers of the FPC. In order to avoid such problems associated with thepost-moisture absorption solderability, it is possible that the FPC ispreliminary-dried before a mounting process so as to remove moisturefrom the FPC; however, this measure involves a problem of productivity,since the measure causes an increase in the number of processes.

In order to solve the problem, an adhesive film it has been proposed, inwhich a property of thermoplastic polyimide used in the adhesive layeris controlled. Specifically, moisture content incorporated in theadhesive film is reduced by increasing a glass transition temperature ofthe thermoplastic polyimide contained in the adhesive film provided onone or both sides of a heat-resistant base film so as to improve theheat resistance of adhesive layer, thereby lowering the water absorptioncoefficient (see, Patent Literature 2 or Patent Literature 3, forexample). A measure to be taken during production processes has beenproposed. This is to remove moisture by preliminary-drying the adhesivefilm when the adhesive film and the metal foil are bonded with eachother (see, Patent Literature 4, for example).

These methods improve post-moisture absorption solderability, which hasbeen an disadvantage associated with a polyimide material. However, alead-free soldering is becoming more likely to be employed forsemiconductor packaging, because of recent increasing awareness ofenvironmental issues. Since the lead-free soldering has a melting pointapproximately 40° C. higher than that of an existing eutectic solder,materials to be used in the mounting process are to be inevitablysubjected to a higher temperature. Accordingly, the materials are nowrequired higher post-moisture absorption solderability as compared tothe conventional case. Further, when the material is used for thepurpose of multilayer FPC, moisture is more likely to be containedinside the material due to a multi-layered structure. This results in astate where the multilayer FPC is prone to defects at a lower soldertemperature than that of the monolayer FPC; that is, the material usedin the multilayer FPC is required further higher post-moistureabsorption solderability.

Citation List

Patent Literature 1

Japanese Patent Application Publication, Tokukaihei, No. 2-180682 A

Patent Literature 2

Japanese Patent Application Publication, Tokukai, No. 2000-129228 A

Patent Literature 3

Japanese Patent Application Publication, Tokukai, No. 2001-260272 A

Patent Literature 4

Japanese Patent Application Publication, Tokukai, No. 2001-270037 A

SUMMARY OF INVENTION Technical Problem

The present invention has been made in view of the foregoing problems,and it is an object of the present invention to provide (i) a film thatis excellent in post-moisture absorption solderability and (ii) aflexible metal-clad laminate produced by use of the film, by controllinga property of a thermoplastic polyimide that is used as an adhesiveagent.

Solution to Problem

The inventors of the present invention has been diligently studied inview of the foregoing problems, and found that it is possible to improvethe post-moisture absorption solderability of the film and the flexiblemetal-clad laminate produced by use of the film, by for example adding acrystallinity to the thermoplastic polyimide that is used as theadhesive agent and then controlling the crystallinity. As a result, theinventors have accomplished the present invention.

That is, a first aspect of the present invention relates to a filmcomprising an adhesive layer on at least one side surface of aheat-resistant polyimide film, the adhesive layer containing athermoplastic polyimide, the thermoplastic polyimide being a crystallinethermoplastic polyimide, the film being such that an absolute value ofan endothermic peak area attributed to melting of the crystallinethermoplastic polyimide is 4.0 mJ/mg or higher, the endothermic peakarea being measured by performing a differential scanning calorimetry onthe film.

A preferable embodiment relates to the film, wherein an absolute valueof an exothermic peak area attributed to recrystallization of thecrystalline thermoplastic polyimide is 4.0 mJ/mg or lower, theexothermic peak area being measured by performing the differentialscanning calorimetry on the film.

A preferable embodiment relates to one of the aforementioned films,wherein the thermoplastic polyimide has a melting point within a rangeof 340° C. to 450° C.

A preferable embodiment relates to one of the aforementioned films,wherein a water absorption coefficient of the heat-resistant polyimidefilm is 1.5% or lower.

A preferable embodiment relates to one of the aforementioned films,wherein the crystalline thermoplastic polyimide is obtainable byimidizing a polyamic acid composed from a combination of a diaminecomponent and a dianhydride component, the diamine component beingselected from the group consisting of 1,4-bis(4-aminophenoxy)benzene;1,3-bis(4-aminophenoxy)benzene; 4,4′-bis(3-aminophenoxy)biphenyl;4,4′-bis(4-aminophenoxy)biphenyl; 1,4-diaminobenzene; and3,4′-diaminodiphenyl ether, the dianhydride component being selectedfrom the group consisting of pyromellitic dianhydride;3,3′,4,4′-biphenyl tetra carboxylic dianhydride; and3,3′,4,4′-benzophenone tetra carboxylic dianhydride.

A preferable embodiment relates to one of the aforementioned films,wherein the crystalline thermoplastic polyimide is contained in anamount of 85 to 100 wt % with respect to the thermoplastic polyimidecontained in the adhesive layer.

A preferable embodiment relates to one of the aforementioned films,wherein the crystalline thermoplastic polyimide is obtainable byimidizing a polyamic acid obtained through the following steps (a) to(c):

(a) a step for obtaining a prepolymer having an amino group or an acidanhydride group at both ends by reacting an aromatic diamine with anaromatic dianhydride in an organic polar solvent under a condition wherethe aromatic diamine or the aromatic dianhydride is contained in excess;

(b) a step for further adding (i) an aromatic diamine having a differentstructure from the aromatic diamine used in (a) or (ii) an aromaticdianhydride having a different structure from the aromatic dianhydrideused in (a); and (c) a step for further adding (i) the aromatic diaminehaving the different structure from the aromatic diamine used in (a) or(ii) the aromatic dianhydride having the different structure from thearomatic dianhydride used in (a) so that the aromatic diamine and thearomatic dianhydride are contained in a substantially equimolar amountthroughout all steps and then performing polymerization.

A preferable embodiment relates to the film, wherein the crystallinethermoplastic polyimide is obtainable by imidizing a polyamic acidobtained through the following steps (a) to (c):

(a) a step for obtaining a prepolymer having amino groups at both endsby reacting the aromatic diamine with the aromatic dianhydride in theorganic polar solvent under a condition where the aromatic diamine iscontained in excess;

(b) a step for further adding the aromatic diamine having a differentstructure from the aromatic diamine used in (a); and

(c) a step for further adding the aromatic dianhydride having adifferent structure from the aromatic dianhydride used in (a) so thatthe aromatic diamine and the aromatic dianhydride are contained in asubstantially equimolar amount throughout all steps and then performingpolymerization.

A preferable embodiment relates to the film, the crystallinethermoplastic polyimide is obtainable by imidizing a polyamic acidobtained through the following steps (a) to (c):

(a) a step for obtaining a prepolymer having acid anhydride groups atboth ends by reacting the aromatic diamine with the aromatic dianhydridein the organic polar solvent under a condition where the aromaticdianhydride is contained in excess;

(b) a step for further adding an aromatic dianhydride having a differentstructure from the aromatic dianhydride used in (a); and

(c) a step for further adding the aromatic diamine having a differentstructure from the aromatic diamine used in (a) so that the aromaticdiamine and the aromatic dianhydride are contained in a substantiallyequimolar amount throughout all steps and then performingpolymerization.

A preferable embodiment relates to one of the aforementioned films,wherein the crystalline thermoplastic polyimide contained in theadhesive layer has a melting point at least 5° C. lower than acrystalline thermoplastic polyimide obtainable by imidizing (i) apolyamic acid obtained through a polymerization performed so that thearomatic diamine used in the step (a) and the aromatic dianhydride usedin the step (a) are contained in a substantially equimolar amount or(ii) a polyamic acid obtained through a polymerization performed so thatthe aromatic diamine used in the steps (b) and (c) and the aromaticdianhydride used in the steps (b) and (c) are contained in asubstantially equimolar amount.

A preferable embodiment relates to one of the aforementioned films,wherein the crystalline thermoplastic polyimide has a melting pointwithin a range of 340° C. to 380° C.

A second aspect of the present invention relates to a flexiblemetal-clad laminate comprising one of the aforementioned films and ametal layer formed on at least one side surface of the film.

A preferable embodiment relates to the flexible metal-clad laminate,which meets both of the following conditions (i) and (ii):

(i) a peeling strength for the metal layer is 10 N/cm or greater, wherea force to peel the metal layer is applied in a 180 degrees direction;and

(ii) defective appearance such as swelling and whitening does not occureven if being exposed under a moisture condition of 40° C. oftemperature and 90% R.H. for 96 hours and thereafter immersed in solderdip of 300° C. for 10 seconds.

A preferable embodiment relates to one of the aforementioned flexiblemetal-clad laminates, wherein the film resulting from removal of themetal layer provided on the film by etching etc. is such that (i) anabsolute value of an endothermic peak area attributed to melting of thecrystalline thermoplastic polyimide is 4.0 mJ/mg or higher, theendothermic peak area being measured by performing a differentialscanning calorimetry on the film, and (ii) an absolute value of anexothermic peak area attributed to recrystallization of the crystallinethermoplastic polyimide is 0.5 mJ/mg or lower, the exothermic peak areabeing measured by performing the differential scanning calorimetry onthe film.

ADVANTAGEOUS EFFECTS OF INVENTION

The film obtainable in the present invention and a flexible metal-cladlaminate produced by bonding a metal foil to the film are excellent inpost-moisture absorption solderability and workability.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention are described as follows.

A film according to the present invention comprises a heat-resistantpolyimide film and an adhesive layer on at least one side of theheat-resistant polyimide film, the adhesive layer containing athermoplastic polyimide. The thermoplastic polyimide is a crystallinethermoplastic polyimide wholly or partially at least by a certainamount.

In the present invention, being “crystalline” means that thethermoplastic polyimide shows a clear endothermic peak (whose peaktemperature is considered as a melting point) by Differential ScanningCalorimetry (DSC) when the thermoplastic polyimide is transited fromsolid state to melting state. On the other hand, a non-crystallinethermoplastic polyimide has no melting point. Therefore, thenon-crystalline thermoplastic polyimide shows no endothermic peakclearly but subtle heat absorption around its glass transitiontemperature.

The “heat-resistant polyimide” used in the film of the present inventioncomprises a non-thermoplastic polyimide by 90 wt % or more. Thenon-thermoplastic polyimide is not particularly limited in terms of itsmolecular structure and thickness. The non-thermoplastic polyimide usedto form the heat-resistant polyimide is generally prepared from apolyamic acid as a precursor. The non-thermoplastic polyimide may becompletely imidized or may partly contain the polyamic acid, which isthe precursor that has not been imidized. Here, the non-thermoplasticpolyimide is a polyimide that is not thermally softened to be adhesive.In the present invention, the non-thermoplastic polyimide is a polyimidethat is not wrinkled or elongated, and thereby keeps its shape afterbeing heated at 450° C. for 2 minutes, or is a polyimide that has noglass transition temperature substantially. The glass transitiontemperature can be determined from a flexion point of a storageelasticity measured by Dynamic Viscoelastic Property (Dynamic MechanicalAnalysis: DMA). Moreover, “having no glass transition temperaturesubstantially” means that the polyimide starts its pyrolysis beforemoving into its glass transition state.

The heat-resistant polyimide film may have any thickness as appropriateto its usage. In general two-layered FPCs, an insulating layer(heat-resistant polyimide film and adhesive layer in total) has athickness of 1 mil (25 μm) or a half mil (12.5 μm) preferably. Thus, itis preferable that the heat-resistant polyimide film has a thickness of7 to 18 μm.

Heat-resistant polyimide films applicable to the film of the presentinvention are not particularly limited, and commercially availablewell-known polyimide films can be used as the heat-resistant polyimidefilm for the film of the present invention. Examples of the commerciallyavailable polyimide films are “Apical” (made by Kaneka corp.), “Kapton”(made by DUPONT-TODAY Co. Ltd.), “Upilex” (made by Ube Industries, Ltd),etc.) Needless to say, a heat-resistant polyimide film appropriatelymade by a conventionally known raw materials or method, etc. may beemployed. For example, the heat-resistant polyimide film may be producedfrom varnish of a polyamic acid, which is prepared in such a manner thatan aromatic tetra carboxylic dianhydride and an aromatic diamine insubstantially equimolar amounts are dissolved in an organic solvent andstirred at a controlled temperature until polymerization of the aromatictetra carboxylic dianhydride and the aromatic diamine is completed,thereby to produce the varnish of the polyamic acid that is a precursor.

As described above, polyimide is a material having a high waterabsorption among plastic. As a raw material of FPC, the heat-resistantpolyimide film preferably has a lower water absorption coefficient inorder to attain better post-moisture absorption solderability. Morespecifically, a heat-resistant polyimide film with a water absorptioncoefficient of 1.5% or lower is preferable. A heat-resistant polyimidefilm with a water absorption coefficient of 1.3% or lower is morepreferable. The use of such a heat-resistant polyimide film with lowwater absorption coefficient makes it possible to lower absolute amountof moisture moving inside the material during soldering immersion. Thisimproves post-moisture absorption solderability.

In order to give the film a lower water absorption coefficient, it isnecessary to lower water absorption coefficients of the heat-resistantpolyimide film and the adhesive layer, respectively. More specifically,for example, this can be attained by (i) using a material a siliconeskeleton or fluorine-type functional group, (ii) dispersing polarity ofimide group by introducing a polar group such as ester group in amolecular skeleton, (iii) by using a material having a relatively largemolecular amount, so as to reduce an amount of imide groups per weight.

The adhesive layer of the film of the present invention comprises thethermoplastic polyimide. The thermoplastic polyimide is a crystallinethermoplastic polyimide wholly or partially at least by a certainamount.

In general, non-crystalline thermoplastic polyimides show sudden drop instorage elasticity around theirs glass transition temperatures, so as tobe softened. Therefore, in case where the thermoplastic polyimideconstituting the adhesive layer of the film is non-crystalline purely,the softening causes abrupt moisture discharge from the film via theadhesive layer to outside. This would cause whitening or swelling of thefilm and the flexible metal-clad laminate. In order to prevent this, theglass transition temperature of the thermoplastic polyimide should be ashigh as temperature used in the component mounting process using solder.On the other hand, the adhesive layer should be soft enough to beadhesive, at the temperature at which the film and the metal foil arebonded together in the manufacturing process of the flexible metal-cladlaminate. For the sake of good productivity in bonding the film with themetal foil, it is necessary to bond the film with the metal foil at atemperature higher than the glass transition temperature of thethermoplastic polyimide of the adhesive layer by 80° C. to 150° C.Therefore, such a demand for post-moisture absorption solderability athigher temperatures tends to make it more difficult to attain a flexiblemetal-clad laminate in which the post-moisture absorption solderabilityand processability are both satisfied.

On the other hand, crystalline thermoplastic polyimides also show dropin storage elasticity around their glass transition temperatures, butthe drop in storage elasticity is not as large as these of thenon-crystalline thermoplastic polyimides. Further, the storageelasticity of the crystalline thermoplastic polyimide generally tends todrop around melting points that are higher than the glass transitiontemperature. Thus, compared with the case of the adhesive layer made ofa non-crystalline thermoplastic polyimide, the use of the adhesive layermade of a crystalline thermoplastic polyimide makes it easier to attainboth the post-moisture absorption solderability and the processability.Conventionally, the crystalline thermoplastic polyimides have been usedin shaping applications such as melt extrusion, injection molding.However, there are only few examples of application of the crystallinethermoplastic polyimides in electronic material applications (to whichthe present invention pertains) in a technical field different from thatof the shaping applications. Japanese Patent Application Publication,Tokukai, No. 2004-209680 uses various thermoplastic polyimides in orderto attain a polyimide metal-clad layer improved in peel strength eventhough a metal foil having a low degree of roughness. Among thethermoplastic polyimides, two thermoplastic polyimides having meltingpoints (Tm) are described, even though the two thermoplastic polyimidesare not described in terms of their crystallinity. Further, JapanesePatent Application Publication, Tokukai, No. 2004-209680 merelydescribes a laminate that is formed by bonding vanish applied and driedon a copper foil, to an insulating film with adhesive layer thereon.Thus, Japanese Patent Application Publication, Tokukai, No. 2004-209680is silent in relationship between post-moisture absorption solderabilityand the crystallinity of the thermoplastic polyimide.

Moreover, apart from the use of the crystalline thermoplastic polyimideto the adhesive layer of the film, the diligent studies of the inventorsof the present invention found that it is important for the improvementof the post-moisture absorption solderability that a crystalline stateof the thermoplastic polyimide be controlled. This is described below inmore details.

The imidization of the precursor of the thermoplastic polyimide iscarried out with heat application. Depending on heating history duringthe heat application, a crystalline state of the thermoplastic polyimidecontained in the adhesive layer of the resultant film can be determined.For example, in order to attain a high soldering heat resistance forproducing a flexible metal-clad laminate by bonding the metal foil tothe film, it is preferable that the thermoplastic polyimide becrystallized to some extent or more before the metal foil is bonded tothe film. More specifically, it is preferable to use a film in which anabsolute value of endothermic peak area due to melting of thecrystalline thermoplastic polyimide is 4.0 mJ/mg or more according todifferential scanning calorimetery of the film. It is further preferableto use a film in which the absolute value of the endothermic peak areadue to the melting of the crystalline thermoplastic polyimide is 5.0mJ/mg or more. The use of such a film produces a flexible metal-cladlaminate with excellent post-moisture absorption solderability. There isno particular limitation as to an upper limit of the endothermic peak.However, it is preferable that the upper limit is 12.0 mJ/mg or less,because, as described later, the productivity can be controlled easilywhen the thermoplastic polyimide is non-crystalline in part.

Moreover, for the sake of excellent post-moisture absorptionsolderability, it is preferable to use a film in which an absolute valueof exothermic peak area due to recrystallization of the crystallinethermoplastic polyimide is 4.0 mJ/mg or less. It is preferable to use afilm in which the absolute value of the exothermic peak area due to therecrystallization of the crystalline thermoplastic polyimide is 3.0mJ/mg or less. There is no particular limitation as to a lower limit ofthe exothermic peak. However, it is preferable that the upper limit is0.2 mJ/mg or more, because, as described later, the productivity can becontrolled easily when the thermoplastic polyimide is non-crystalline inpart.

The area of the endothermic peak due to the melting of the crystallinethermoplastic polyimide according to differential scanning calorimeteryof the film is an index of proceeding of the crystallization of thethermoplastic polyimide. In general, it is determined that thecrystallization has been proceeded further when the peak area is greaterand peak shape is sharper. On the other hand, the area of the exothermicpeak due to the recrystallization of the crystalline thermoplasticpolyimide is also an index of proceeding of the crystallization of thethermoplastic polyimide. As to the peak area due to recrystallization,the heat of the differential scanning calorimetery causescrystallization, which generates heat to observe. Thus, it is determinedthat the crystallization has been proceeded further if the generationpeak area due to the recrystallization is smaller. The endothermic peakand the exothermic peak can be determined according to the heatinghistory during the film production. This is described later in details.

The crystalline thermoplastic polyimide contained in the adhesive layerof the film of the present invention can be obtained via the imidizationof a polyamic acid, which is a precursor thereof. The polyamic acid canbe prepared by any method, and may be prepared by using a conventionallyknown method. One general example of the method comprises mixing adiamine component and an acid dianhydride component in an organicsolvent and performing polymerization with the diamine component and theacid dianhydride component so as to prepare an organic solvent solutionof polyamic acid. By selecting appropriate structures for the diaminecomponent and the acid dianhydride component, it is possible to givecrystallinity to the thermoplastic polyimide obtained through theimidization of the polyimide acid obtained via the polymerization of thediamine component and the acid dianhydride component. However, asdescribed above, polyimide is obtained from polymerization of a diaminecomponent and an acid dianhydride component. Thus, use of only one ofthe particular diamine component and acid dianhydride component does notpromise crystallinity of the polyimide. The use of the particulardiamine component and acid dianhydride component in combinationdetermines whether the crystallinity of the polyimide is attained ornot.

Being aware of the importance of the combination, examples of thediamine component and the acid anhydride component usable as rawmaterials of the crystalline thermoplastic polyimide contained in theadhesive layer of the film of the present invention are given below.Preferable examples of the diamine component are: ether diamines such as1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene,4,4′-bis(3-aminophenoxy)biphenyl, and 4,4′-bis(4-aminophenoxy)biphenyl;phenylene diamine such as 1,4-diaminobenzene; and the like. Thesediamine components make it easier to attain the crystallinity.

As to the acid dianhydride component, preferable examples arepyromellitic dianhydride; 3,3′,4,4′-biphenyl tetra carboxylicdianhydride; and the like. Of course the diamine components and aciddianhydride components usable as the raw materials of the thermoplasticpolyimide of the present invention are not limited to these examplesgiven above. Raw materials with other structures may be used, providedthat the thermoplastic polyimide attains crystallinity as a result ofthe combination of the diamine component and the acid dianhydride.

In the present invention, particularly preferable examples of thecombinations of the diamine component and the acid dianhydride componentare: a combination of 1,4-bis(4-aminophenoxy)benzene,1,3-bis(4-aminophenoxy)benzene, and 3,3′,4,4′-biphenyl tetra carboxylicdianhydride; a combination of 1,3-bis(4-aminophenoxy)benzene and3,3′,4,4′-biphenyl tetra carboxylic dianhydride; a combination of1,3-bis(4-aminophenoxy)benzene, 3,4′-diaminodiphenyl ether,3,3′,4,4′-biphenyl tetra carboxylic dianhydride, and3,3′,4,4′-benzophenone tetra carboxylic dianhydride; and the likecombinations.

In the present invention, the thermoplastic polyimide contained in theadhesive layer is a crystalline thermoplastic polyimide wholly or partlyby a particular amount or more. In view of the post-moisture absorptionsolderability and processability, it is preferable that the crystallinethermoplastic polyimide is contained in an amount of 85 wt % to 100 wt %with respect to the thermoplastic polyimide contained in the adhesivelayer. Furthermore, it is more preferable that the crystallinethermoplastic polyimide is contained in an amount of 90 wt % to 100 wt %with respect to the thermoplastic polyimide contained in the adhesivelayer.

In the present invention, the polymerization of the polyamic acid thatis the precursor of the thermoplastic polyimide is not particularlylimited in terms of various conditions such as its organic solvent,polymerization temperature, polymerization concentration, etc., and canbe carried out under conventionally well-known conditions.

How to perform the imidization of the polyamic acid thus obtained is notparticularly limited. The imidization can be carried out by thermalcuring method in which the imidization is carried out by use of heatonly, or by chemical curing method in which a chemical curing agentincluding a chemical dehydrating agent and a catalyst is used. As analternative, the thermal curing method and the chemical curing methodcan be employed together. This is also true for the production of theheat-resistant polyimide film, apart from the production of thethermoplastic polyimide.

The chemical dehydrator may be a dehydrating ring-closing agent. Forexample, the chemical dehydrator may be an aliphatic acid anhydride, anaromatic acid anhydride, N,N′-dialkyl carbodiimide, low aliphatichalide, low aliphatic acid anhydride halide, aryl sulfonic dihalide,thionyl halide, or any combination of two or more of these. Among these,the aliphatic acid anhydride and aromatic anhydride are effectiveparticularly.

Moreover, in a broad sense, the catalyst is a substance that promotesthe dehydrating ring-closure of the chemical dehydrating agent to thepolyamic acid. Examples of the catalyst are aliphatic tertiary amines,aromatic tertiary amines, and hetrocyclic tertiary amines. Among these,hetrocyclic tertiary amines such as imidazol, benziimidazol, isoquinone,quinorine, and β-picoline are particularly preferable. Furthermore,where appropriate, it may be arranged such that an organic polar solventis added to a solution of the chemical dehydrating agent and thecatalyst.

As to a quantity of the chemical dehydrating agent, it is preferablethat 0.5 mol to 5 mol of the chemical dehydrating agent is used per onemol of amidic acid unit in the polyamic acid contained in the solutionto which the chemical dehydrating agent and the catalyst are to beadded. It is more preferable that 0.7 mol to 4 mol of the chemicaldehydrating agent is used per one mol of amidic acid unit in thepolyamic acid contained in the solution to which the chemicaldehydrating agent and the catalyst are to be added. As to a quantity ofthe catalyst, it is preferable that 0.05 mol to 3 mol of the catalyst isused per one mol of amidic acid unit in the polyamic acid contained inthe solution to which the chemical dehydrating agent and the catalystare to be added. It is more preferable that 0.2 mol to 2 mol of thecatalyst is used per one mol of amidic acid unit in the polyamic acidcontained in the solution to which the chemical dehydrating agent andthe catalyst are to be added. Quantities of the chemical dehydratingagent and the catalyst lower than the ranges cause insufficient chemicalimidization, which would cause tearing in the baking, or low chemicalstrength. Moreover, quantities of the chemical dehydrating agent and thecatalyst greater than the ranges would cause excessively fastimidization, which makes it difficult to cast the polyimide into a filmshape.

The film of the present invention gives the flexible metal-clad laminateexcellent post-moisture absorption solderability. Thus, the crystallinethermoplastic polyimide contained in the adhesive layer preferably has amelting point high to some extent. More specifically, the melting pointis preferably not less than 340° C., but not more than 450° C. Moreover,a lower limit of the melting point is preferably 350° C. or higher, morepreferably 355° C. or higher, and especially preferably 360° C. orhigher. On the other hand, an upper limit of the melting point ispreferably 420° C. or lower, more preferably 400° C. or lower,especially preferably 385° C. or lower, and particularly 380° C. orlower. A melting point lower than the range means that the adhesivelayer start to be softened at a lower temperature. This would lead tofailure to attain improvement of the post-moisture absorptionsolderability. On the other hand, a melting point higher than the rangemeans that for example the adhesive layer becomes insufficiently soft atthe temperature at which the metal foil and film are bonded together.This would cause lower adhesion strength between the metal foil and thefilm.

On the other hand, as described above whether or not the crystallinityof the thermoplastic polyimide can be attained or not is highlydependent on the combination of the aromatic diamine and aromatic acidanhydride from which the thermoplastic polyimide is prepared. This meansthat it is not easy always to control the property of the thermoplasticpolyimide. In some cases, if part of the combination of the rawmaterials is changed with another one in order to lower the meltingpoint for better processability, it would cause loss or reduction of thecrystallinity of the thermoplastic polyimide. This might require totalchange in the combination of the raw materials. The inventors of thepresent invention found that even in such a case, it is possible tocontrol the melting point of the thermoplastic polyimide by controllingan order of addition of the monomers from which the crystallinethermoplastic polyimide is formed. In order to improve theprocessability of the film whose adhesive layer is made from acrystalline thermoplastic polyimide, it is important to obtain thecrystalline thermoplastic polyimide from imidization of a polyamic acidsolution obtained via the following steps (a) to (c):

(a) a step for obtaining a prepolymer having an amino group or an acidanhydride group at both ends by reacting an aromatic diamine with anaromatic dianhydride in an organic polar solvent under a condition wherethe aromatic diamine or the aromatic dianhydride is contained in excess;

(b) a step for further adding (i) an aromatic diamine having a differentstructure from the aromatic diamine used in (a) or (ii) an aromaticdianhydride having a different structure from the aromatic dianhydrideused in (a); and

(c) a step for further adding (i) the aromatic diamine having thedifferent structure from the aromatic diamine used in (a) or (ii) thearomatic dianhydride having the different structure from the aromaticdianhydride used in (a) so that the aromatic diamine and the aromaticdianhydride are contained in a substantially equimolar amount throughoutall steps and then performing polymerization.

More specifically, for example, in case where a polyamic acid solutionin which the polyamic acid has amine terminals finally, it is possibleto obtain the crystalline thermoplastic polyimide from imidization of apolyamic acid solution obtained via the following steps (a) to (c):

(a) a step for obtaining a prepolymer having amino groups at both endsby reacting the aromatic diamine with the aromatic dianhydride in theorganic polar solvent under a condition where the aromatic diamine iscontained in excess;

(b) a step for further adding the aromatic diamine having a differentstructure from the aromatic diamine used in (a); and

(c) a step for further adding the aromatic dianhydride having adifferent structure from the aromatic dianhydride used in (a) so thatthe aromatic diamine and the aromatic dianhydride are contained in asubstantially equimolar amount throughout all steps and then performingpolymerization.

Moreover, for example, in case where a polyamic acid solution in whichthe polyamic acid has acid anhydride terminals finally, it is possibleto obtain the crystalline thermoplastic polyimide from imidization of apolyamic acid solution obtained via the following steps (a) to (c):

(a) a step for obtaining a prepolymer having acid anhydride groups atboth ends by reacting the aromatic diamine with the aromatic dianhydridein the organic polar solvent under a condition where the aromaticdianhydride is contained in excess;

(b) a step for further adding an aromatic dianhydride having a differentstructure from the aromatic dianhydride used in (a); and

(c) a step for further adding the aromatic diamine having a differentstructure from the aromatic diamine used in (a) so that the aromaticdiamine and the aromatic dianhydride are contained in a substantiallyequimolar amount throughout all steps and then performingpolymerization.

Therefore, coexisted in the molecular chain of the polyamic acid thusobtained via the steps above are blocks (hereinafter, Blocks A) preparedfrom the raw materials used in Step (a), and blocks (hereinafter, BlocksB) prepared from the raw materials used in Step (b) or (c). Bycontrolling the structures of Blocks A and B and a ratio between BlocksA and B, it is possible to control the melting point of “the crystallinethermoplastic polyimide obtained via the imidization of the polyamicacid” as a whole.

As to Blocks A and B, it is necessary that at least either Blocks A or Bbe blocks derived from a crystalline thermoplastic polyimide. It is alsoacceptable that both of Blocks A and B are blocks derived fromcrystalline thermoplastic polyimides. Whether the crystallinity appearsor not is largely dependent on the combination of the diamine componentand the acid dianhydride. Thus, the crystallinity can not be attainedsimply by selecting the structure of one of the diamine component andthe acid dianhydride. In the following, examples of the diaminecomponent and the acid dianhydride usable as the raw materials of theblocks derived from the crystalline thermoplastic polyimide are given.It should be noted that their combinations are to be considered.Preferable examples of the aromatic diamine component for easilyattaining the crystallinity are Ether-type diamines such as1,4-bis(4-aminophenoxy)benzene; 1,3-bis(4-aminophenoxy)benzene,4,4′-bis(3-aminophenoxy)biphenyl, and 4,4′-bis(4-aminophenoxy)biphenyl;phenylene-type diamines 1,4-diaminobenzene; and the like. On the otherhand, preferable examples of the aromatic acid dianhydride component foreasily attaining the crystallinity are: pyromellitic dianhydride,3,3′,4,4′-biphenyl tetra carboxylic dianhydride, and the like. Needlessto say, the present invention is not limited to these in terms of thearomatic diamine component and the aromatic acid dianhydride componentto use. Raw materials of another structures are also usable in thepresent invention, provided that a thermoplastic polyimide obtained as aresult of a particular combination of that aromatic diamine componentand that aromatic acid dianhydride component shows crystallinity.

As to the ratio of Blocks A and B, it is necessary that the blocksderived from the crystalline thermoplastic polyimide be greater in theratio. More specifically, the blocks derived from the crystallinethermoplastic polyimide are preferably 80 mol % or more, and morepreferably 90 mol % or more. As to an upper limit of the ratio, theblocks derived from the crystalline thermoplastic polyimide arepreferably 98 mol % or less, and more preferably 96 mol % or less. Ifthe ratio is smaller than the range, the resultant thermoplasticpolyimide would be poorly crystalline. On the contrary, if the ratio isgreater than the range, the melting control would not be effectiveenough.

The case where Blocks A and B are blocks derived from the crystallinethermoplastic polyimides is preferable, because all the blocks areblocks derived from the crystalline thermoplastic polyimides. In thiscase, blocks whose property is to be dominant is added in the ratiosmentioned above.

The thermoplastic polyimide according to the present inventionobtainable via the polymerization method mentioned above can be lower inmelting point preferably by 5° C. or more, and more preferably by 10° C.or more, compared with a crystalline thermoplastic polyimide obtainablefrom Blocks A or B solely. It is not yet understood why thepolymerization method can lower only the melting point of thermoplasticpolyimide without loosing the crystallinity. However, it is deduced thatthe sparse presence of a small amount of block component of a structuredifferent from that of main block components in the molecular chainmakes some change in the crystalline state of the polyimide as a whole.

In addition to the thermoplastic polyimide, the adhesive layer of thefilm according to the present invention may contain, if necessary,organic/inorganic particles such as a filler, in order to control linearthermal expansion coefficient, slidability, etc. In this case, an amountof the filler to add is 0.001 wt % to 10 wt %, and more preferably 0.01wt % to 1.0 wt % with respect to the adhesive layer. Here, finecrystalline particles of the crystalline thermoplastic polyimide in theadhesive layer of the film according to the present invention can alsoplay a role of lubricant. Thus, there is little need of improving theslidability. Thus, the amount of the filler can be small.

Moreover, the adhesive layer of the film according to the presentinvention is not limited as to its thickness, and may have any thicknessas appropriate, in consideration of a thickness of the film as a whole,surface roughness of the metal layer to which the adhesive layer is tobe bonded, and other conditions. For example, it is preferable that thethickness of the adhesive layer be in a range of 1 μm to 10 μm. It ismore preferable that the thickness of the adhesive layer be in a rangeof 1.5 μm to 6 μm. A thickness of the adhesive layer thicker than theseranges does not further contribute to the adhesion strength, but makesit difficult to control the linear thermal expansion coefficient of thefilm. A thinner thickness of the adhesive layer thinner than theseranges would lead to defective adhesion because the adhesive layercannot sufficiently engage with the roughness of the surface of themetal layer such as a metal foil.

The film according to the present invention may be fabricated by anymethod. For example, it is preferable to fabricate the film according tothe present invention by (i) forming the adhesive layer on one side orboth side of the heat-resistant polyimide film that serves as a core, by(ii) forming the adhesive layer into a sheet form and bonding theadhesive layer in the sheet form to the heat-resistant polyimide filmthat serves as the core, by (iii) forming the core layer and theadhesive layer concurrently by multi-layer extrusion or the like, or(iv) by the like method. Among these methods, when the method (i) isemployed, it is sometimes difficult to provide the adhesive layer on theheat-resistant polyimide film, because if the polyamic acid that is theprecursor of the thermoplastic polyimide contained in the adhesive layerwas completely imidized, the polyamic acid would be less soluble in anorganic solvent. In view of this, it is more preferable that a solutionin which the polyamic acid that is the precursor of the thermoplasticpolyimide contained in the adhesive layer is dissolved is prepared andapplied on the heat-resistant polyimide film that serves as the core,and then the imidization is performed. In case where the thermoplasticpolyimide is soluble, it may be so arranged that the imidization isperformed in advance. Moreover, the imidization can be performed by anymethods encompassing conventionally well-known methods, and is notlimited to the thermal curing method or the chemical curing method.

Any methods for the imidization require heating for increasing theirproductivity. Thus, as described above, the heating history during thefilm production changes the crystallinity of the thermoplastic polyimidein the resultant film. By differential scanning calorimetery this can beobserved as a difference between the endothermic peak due to the meltingand the exothermic peak due to the recrystallization. The melting andrecrystallization of crystals occur when heated under high temperatureatmosphere at a temperature at or above the melting point of thecrystalline thermoplastic polyimide contained in the adhesive layer ofthe film, and then cooled. Thus, by appropriately controlling a coolingrate after applying a temperature at or above the melting point, alarger endothermic peak area with a sharper shape tends to be obtained.Moreover, the appropriate control of the cooling rate is preferable alsobecause it reduces crystal particle sizes, thereby improving theadhesive layer of the resultant film in terms of transparency. Theexothermic peak due to the recrystallization tends to be smaller in itspeak area when the crystallization proceeds sufficiently, byappropriately controlling the cooling rate after thermally melting theadhesive layer is controlled, more specifically by slowing the coolingrate compared with crystallization rate of the thermoplastic polyimide.The crystallization rate is dependent on the structure of thethermoplastic polyimide. Thus, it can be selected as appropriate,depending on the composition of the thermoplastic polyimide. Moreover,excessive crystallization will lower flowability of the adhesive layer.For example, this deteriorates the processability of the adhesive layerin bonding the adhesive layer to the metal layer. Therefore, thecrystalline thermoplastic polyimide may be non-crystalline in part tosome extent. In this case, as described above, a sufficient solder heatresistance can be ensured by controlling the absolute value of theexothermic peak area due to the recrystallization that occurs afterbonding the adhesive layer to the metal foil.

The flexible metal-clad laminate according to the present invention canbe attained by providing a metal layer on one side or both sides of thefilm. There is no particular limitation as to how to provide the metallayer. For example, the metal layer can be provided by bonding a metalfoil to the film, by forming the metal layer via plating or vapordeposition, or by the like method.

As for the method in which the metal foil is bonded to the film, themetal foil usable in this method is not limited to a particular one. Incase the flexible metal-clad laminate according to the present inventionis employed in electronic apparatuses or electric apparatuses, a metalfoil made of, for example, copper, copper alloy, stainless steel,stainless steel alloy, nickel, nickel alloy (inclusive of 42 alloy),aluminum, or aluminum alloy. The present invention can preferably employa rolled copper foil, electrolysis copper foil, etc. which are popularlyused in general flexible metal-clad laminate. Moreover, an anti-rustinglayer, heat-protecting layer, or an adhesive layer may be provided on atop surface of the metal foil.

In the present invention, the metal foil is not particularly limited asto its thickness, and may have any thickness, provided that the metalfoil can function sufficiently according to usage.

There is no particular limitation as to how to bond the film and themetal foil. For example, continuous treatment using (i) a heat rolllaminating apparatus having one or more pairs of metal rollers or (ii) adouble-belt press (DBP) may be employed. Especially, the heat rolllaminating apparatus having one or more pairs of metal rollers ispreferable because its structure is simple and maintenance cost is low.Here, the “heat roll laminating apparatus having one or more pairs ofmetal rollers” can be any apparatus having a metal roller(s) forapplying heat and pressure to materials, and is not limited toparticular structure in details.

It is preferable that the film and the metal foil are bonded with eachother at or above a temperature that is higher than the glass transitiontemperature (Tg) of the thermoplastic polyimide in the adhesive layer ofthe film by 50° C. or more (Tg+50° C.), and at or above a temperaturethat is lower than the melting point (Tm) of the thermoplastic polyimideby 50° C. or more (Tm−50° C.). It is more preferable that the film andthe metal foil are bonded with each other at or above a temperature ishigher than Tg of the thermoplastic polyimide in the adhesive layer ofthe film by 100° C. or more (Tg+100° C.), and at or above a temperaturethat is lower than Tm of the thermoplastic polyimide by 20° C. or more(Tm−20° C.). The temperature at or above Tg+50° C. and Tm−50° C. makesit possible to good heat lamination of the film and metal foil. Thetemperature at or above Tg+100° C. and Tm−20° C. makes it possible tocontinuously bond the film with the metal foil at a higher laminationrate, thereby improving productivity.

In the flexible metal-clad laminate according to the present invention,it is very preferable that the following two conditions (i) and (ii) aresatisfied:

(i) a peeling strength for the metal layer is 10 N/cm or greater, wherea force to peel the metal layer is applied in a 180 degrees direction;and

(ii) defective appearance such as swelling and whitening does not occureven if being exposed under a moisture condition of 40° C. oftemperature and 90% R.H. for 96 hours and thereafter immersed in solderdip of 300° C. for 10 seconds.

In order to satisfy the conditions, it is preferable that thecrystallinity of the adhesive layer after the formation of the metallayer is controlled. More specifically, for example, it is preferablethat the film exhibiting an absolute value of 4.0 mJ/mg or higher whenan endothermic peak area attributed to melting of the crystallinethermoplastic polyimide is measured by performing a differentialscanning calorimetry on the film, and that the absolute value that thefilm exhibits is 0.5 mJ/mg or lower when an exothermic peak areaattributed to recrystallization of the crystalline thermoplasticpolyimide is measured by performing the differential scanningcalorimetry on the film.

In order to satisfying the conditions, the temperature at which the filmand the metal foil are bonded, and the cooling rate can be appropriatelycontrolled, as in the film production. More specifically, thecrystallization state can be controlled by arranging such that thelamination is performed at a temperature close to the melting point ofthe thermoplastic polyimide, so as to melt the thermoplastic polyimide,and then the cooling subsequent the lamination is carried out at acooling rate that is slower than the crystallization rate of thethermoplastic polyimide.

In order to attain a higher peeling strength for the metal layer, it isnecessary to have a greater flowability of the adhesive layer. However,an adhesive layer with such a greater flowability is softened by thesolder-dip temperature. This leads to deterioration of the post-moistureabsorption solderability. Thus, the improvement of the peeling strengthhas basically required the sacrifice of the post-moisture absorptionsolderability, and these properties cannot be attained at high levelstogether. On the other hand, the flexible metal-clad laminate accordingto the present invention can attain both the properties, and isapplicable to lead-free soldering FPCs, or multi-layer FPCs. Needless tosay, the present invention is not limited to these applications, and isapplicable to various usage in which a laminate with a metal layer isused.

Examples

In the following, the present invention is more specifically describedwith reference to Examples and Comparative Examples, to which thepresent invention is not limited. In Examples and Comparative Examples,melting points (Tm) and glass transition Temperatures (Tg) ofthermoplastic polyimides used in an adhesive layer, water absorptioncoefficient of polyimide films, and post-moisture absorptionsolderability of flexible metal-clad laminates, and peeling strength ofmetal foils were measured or evaluated in the following manners.

[Melting of Thermoplastic Polyimide]

The thermoplastic polyimide precursor solution thus obtained inSynthesis Example was spread over a shin surface of a rolled copper foil(BHY-22B-T; made by Nippon Mining & Metals Co. Ltd.) of 18 μm inthickness, so that a film of the thermoplastic polyimide precursorsolution was formed thereon with a thickness of 20 μm finally. Then, thefilm was dried at 130° C. for 3 minutes, at 200° C. for 2 minutes, at250° C. for 2 minutes, at 300° C. for 2 minutes, or at 350° C. for 1minutes. After the drying, the copper foil was etched away from thefilm. Then, the film was dried 50° C. for 30 minutes, thereby asingle-layered sheet of the thermoplastic polyimide.

By using a DSC 220 made by Seiko Instruments Inc., the single-sheet ofthe thermoplastic polyimide was measured in a temperature program in arange from 0° C. to 450° C. with a temperature rising rate of 10° C./minand temperature dropping rate of 40° C./min, wherein aluminum was usedas control. A peak of heat absorption chart in the temperature increasestep was considered as a melting point. Here, when the heat absorptionchart was broadened, thereby reducing its area, this phenomenon isreferred to as “Broad”, indicating that crystallinity was deteriorated.

[Endothermic Peak of Thermoplastic Polyimide, and Calculation ofAbsolute Area of Endothermic Peak]

Before bonding a metal foil thereto after bonding the metal foil theretoand then etched away the metal foil therefrom, the films thus obtainedin Example were measured by using differential scanning calorimetery,after treated in the same manner as in the melting point calculation.Thereby, charts were obtained for the films. By drawing tangents line onthe charts, an area of endothermic peak due to melting, and an area ofexothermic peak due to crystallization were worked out for each film.When the endothermic peak is broadened, a peak area absolute valueapparently increases accordingly. Thus, in case where broadeningoccurred, it is expressed as “broad”.

[Glass Transition Temperature of Thermoplastic Polyimide]

Glass Transition temperatures of the films were measured after treatingthe films in the same manner as in the measurement of melting points.Inflection points of heat absorption charts during the heat increasestep are considered as the glass transition temperature.

[Polyimide Film Water Absorption Coefficient]

The films were cut into a 20 cm square shape and dried at 150° C. for 30minutes. Weights of the films after the drying are put as W₁. After thedrying the films were immersed in pure water at 20° C. for 24 hours.Weights of the films after the immersion were put as W₂. Weight changesof the films were worked out from the following equation:

Water Absorption Coefficient (%)={(W ₂ −W ₁)/W ₁}×100

[Post-Moisture Absorption Solderability of Flexible Metal-Clad Laminate]

From each of the both-sided flexible metal-clad laminates obtained inExamples and Comparative Examples, two samples were prepared by etchingan upper-side copper foil and a lower-side copper foil to a size of 1cm×1.5 cm so that the two copper foils of this size overlap with eachother. The samples thus obtained were subjected to moisture absorptiontreatment by being left at 40° C. for 96 hours under a moisturecondition of 90% R.H. After the moisture absorption treatment, thesamples were immersed in a solder bath of 250° C., 270° C., or 300° C.for 10 seconds. The samples were visually observed after one of thecopper foils was etched away after the solder bathing. If a part coveredwith the copper foils showed no appearance change, the films wereevaluated as good. If the part showed at least one of whitening of thefilm layer, swelling of the film layer, or peeling-off of any copperlayer, the film was evaluated as poor.

[Metal-Foil Peeling Strength of Flexible Metal-Clad Laminate]

According to JIS C6471 “6.5 Peeling Strength”, a sample was prepared anda load was determined which peeled the metal foil in a 5 mm width fromthe sample at 180° peeling angle at a rate of 50 mm/min.

Synthesis Example 1 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 637.0 g ofN,N-dimethylformamide (hereinafter, may be referred to as DMF), and 68.2g of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (hereinafter, may bereferred to as BPDA were added. Then, under nitrogen atmosphere, 20.3 gof 1,4-bis(4-aminophenoxy)benzene (hereinafter, may be referred to asTPE-Q) and 45.4 g of 1,3-bis(4-aminophenoxy)benzene (TPE-R) were addedtherein with stirring. Then, a mixture thus prepared was stirred at 25°C. for 1 hour, thereby obtaining a reaction solution. A DMF solution ofTPE-R, in which 2.0 g of TPE-R was dissolved in 27.0 g of DMF, wasseparately prepared. The DMF solution was gradually added in thereaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached1200 poise, the addition and stirring were stopped, thereby obtaining apolyamic acid solution.

Synthesis Example 2 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 637.2 g of DMF, and 67.8 g ofBPDA were added. Then, under nitrogen atmosphere, 4.2 g of4,4′-bis(4-aminophenoxy)biphenyl (hereinafter, may be referred to asBAPB), and 62.0 g of TPE-R were added therein with stirring. Then, amixture thus prepared was stirred at 25° C. for 1 hour, therebyobtaining a reaction solution. A DMF solution of TPE-R, in which 2.0 gof TPE-R was dissolved in 27.0 g of DMF, was separately prepared. TheDMF solution was gradually added in the reaction solution with stirring,while monitoring viscosity of the reaction solution. When the viscosityof the reaction solution reached 1200 poise, the addition and stirringwere stopped, thereby obtaining a polyamic acid solution.

Synthesis Example 3 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 637.0 g of DMF, and 68.2 g ofBPDA were added. Then, under nitrogen atmosphere, 65.8 g of TPE-R wasadded therein with stirring. Then, a mixture thus prepared was stirredat 25° C. for 1 hour, thereby obtaining a reaction solution. A DMFsolution of TPE-R, in which 2.0 g of TPE-R was dissolved in 27.0 g ofDMF, was separately prepared. The DMF solution was gradually added inthe reaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached1200 poise, the addition and stirring were stopped, thereby obtaining apolyamic acid solution.

Synthesis Example 4 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 780.0 g of DMF, and 117.2 g ofbis[4-(4-aminophenoxy)phenyl]sulfone (hereinafter, may be referred to asBAPS) were added. Then, under nitrogen atmosphere, 71.7 g of BPDA wasgradually added therein with stirring. After that, 5.6 g of3,3′,4,4′-ethyleneglycoldibenzoate tetracarboxylic dianhydride(hereinafter, may be referred to as TMEG) was added therein. Then, amixture thus prepared was stirred at 25° C. for 30 minutes, therebyobtaining a reaction solution. A DMF solution of TMEG, in which 5.5 g ofTMEG was dissolved in 20.0 g of DMF, was separately prepared. The DMFsolution was gradually added in the reaction solution with stirring,while monitoring viscosity of the reaction solution. When the viscosityof the reaction solution reached 1500 poise, the addition and stirringwere stopped, thereby obtaining a polyamic acid solution.

Synthesis Example 5 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 632.4 g of DMF, and 56.8 g ofBPDA were added. Then, under nitrogen atmosphere, 76.8 g of2,2-bis[4-(4-aminophenoxy)phenyl]propane (hereinafter, may be referredto as BAPP) was added therein with stirring. Then, a mixture thusprepared was stirred at 25° C. for 1 hour, thereby obtaining a reactionsolution. A DMF solution of BAPP, in which 2.4 g of BAPP was dissolvedin 31.6 g of DMF, was separately prepared. The DMF solution wasgradually added in the reaction solution with stirring, while monitoringviscosity of the reaction solution. When the viscosity of the reactionsolution reached 1200 poise, the addition and stirring were stopped,thereby obtaining a polyamic acid solution.

Synthesis Example 6 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 631.7 g of DMF, and 55.1 g ofBPDA were added. Then, under nitrogen atmosphere, 77.7 g of BAPS wasadded therein with stirring. Then, a mixture thus prepared was stirredat 25° C. for 1 hour, thereby obtaining a reaction solution. A DMFsolution of BAPS, in which 2.4 g of BAPS was dissolved in 32.2 g of DMF,was separately prepared. The DMF solution was gradually added in thereaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached1200 poise, the addition and stirring were stopped, thereby obtaining apolyamic acid solution.

Synthesis Example 7 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 631.7 g of DMF, and 7.4 g of3,3′,4,4-benzophenonetetracarboxylic dianhydride (hereinafter, may bereferred to as BTDA) were added and stirred under nitrogen atmosphere.Thereafter it was visually confirmed that BTDA was dissolved therein.Then, 6.1 g of 1,3-bis(3-aminophenoxy)benzene (hereinafter, may bereferred to as APB) was added therein, followed by 30-minute stirring.After that, 61.1 g of BPDA was added therein, and then 59.3 g of TPE-Rwas added therein with stirring. Then, a mixture thus prepared wasstirred at 25° C. for 2 hour, thereby obtaining a reaction solution. ADMF solution of TPE-R, in which 2.0 g of TPE-R was dissolved in 27.0 gof DMF, was separately prepared. The DMF solution was gradually added inthe reaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached1200 poise, the addition and stirring were stopped, thereby obtaining apolyamic acid solution.

Synthesis Example 8 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 636.7 g of DMF, and 7.5 g ofBTDA were added and stirred under nitrogen atmosphere. Thereafter it wasvisually confirmed that BTDA was dissolved therein. Then, 4.2 g of3,4′-diaminodiphenylether (hereinafter, may be referred to as 3,4′-ODA)was added therein, followed by 30-minute stirring. After that, 62.0 g ofBPDA was added therein, and then 60.2 g of TPE-R was added therein withstirring. Then, a mixture thus prepared was stirred at 25° C. for 2hour, thereby obtaining a reaction solution. A DMF solution of TPE-R, inwhich 2.1 g of TPE-R was dissolved in 27.0 g of DMF, was separatelyprepared. The DMF solution was gradually added in the reaction solutionwith stirring, while monitoring viscosity of the reaction solution. Whenthe viscosity of the reaction solution reached 1200 poise, the additionand stirring were stopped, thereby obtaining a polyamic acid solution.

Synthesis Example 9 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 636.5 g of DMF, and 15.2 g ofBTDA were added and stirred under nitrogen atmosphere. Thereafter it wasvisually confirmed that BTDA was dissolved therein. Then, 8.5 g of3,4′-ODA was added therein, followed by 30-minute stirring. After that,55.6 g of BPDA was added therein, and then 54.6 g of TPE-R was addedtherein with stirring. Then, a mixture thus prepared was stirred at 25°C. for 2 hour, thereby obtaining a reaction solution. A DMF solution ofTPE-R, in which 2.1 g of TPE-R was dissolved in 27.5 g of DMF, wasseparately prepared. The DMF solution was gradually added in thereaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached1200 poise, the addition and stirring were stopped, thereby obtaining apolyamic acid solution.

Synthesis Example 10 Synthesis of Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 637.1 g of DMF, and 7.4 g ofBTDA were added and stirred under nitrogen atmosphere. Thereafter it wasvisually confirmed that BTDA was dissolved therein. Then, 61.1 g of BPDAwas added therein. After that, 61.1 g of BPDA was added therein, andthen 6.1 g of APB and 59.3 g of TPE-R were added therein with stirring.Then, a mixture thus prepared was stirred at 25° C. for 2 hour, therebyobtaining a reaction solution. A DMF solution of TPE-R, in which 2.0 gof TPE-R was dissolved in 27.0 g of DMF, was separately prepared. TheDMF solution was gradually added in the reaction solution with stirring,while monitoring viscosity of the reaction solution. When the viscosityof the reaction solution reached 1200 poise, the addition and stirringwere stopped, thereby obtaining a polyamic acid solution.

Synthesis Example 11 Synthesis of Non-Thermoplastic Polyimide Precursor

Into a glass flask of 2000 ml in volume, 657.8 g of DMF, 10.5 g of3,4′-ODA, and 32.4 g of BAPP were added and stirred at 20° C. undernitrogen atmosphere. Thereafter it was visually confirmed that they weredissolved therein. Then, 17.0 g of BTDA and 14.3 g of pyromelliticdianhydride (hereinafter, may be referred to as PMDA) were addedtherein, followed by 30-minute stirring. After that, 14.2 g ofp-phenylenediamine (hereinafter, may be referred to as p-PDA) wasfurther added therein, followed by 30-minute stirring. Furthermore, 30.4g of PMDA was added therein, followed by 30-minute stirring. A DMFsolution of PMDA, in which PMDA of 3 mol % was dissolved to make a solidcontent of 7 wt %, was prepared. The DMF solution was gradually added inthe reaction solution with stirring, while monitoring viscosity of thereaction solution. When the viscosity of the reaction solution reached2500 poise at 20° C., polymerization was terminated.

Example 1

After the polyamic acid solution obtained in Synthesis Example 1 wasdiluted with DMF to a solid content of 8.5 wt %, the diluted polyamicacid solution was applied on both sides of a heat-resistant polyimidefilm (Apical 17FP, Kaneka Corp, water absorption coefficient 1.4%) of 17μm thickness, so as to make a thermoplastic polyimide layer (to be anadhesive layer) of 4 μm final thickness on each side. Then, a laminatethus prepared was heated at 140° C. for 1 minute. Then, the laminate wassubjected to heat treatment of 390° C. for 20 seconds for imidization,thereby obtaining a film.

On each side of the film thus prepared, a rolled copper foil of 18 μmthickness (BHY-22B-T; Nippon Mining & Metals Co. Ltd.) was provided.Then, a protective material (Apical 125NPI; Kanaka Corp.) was providedon the top of each copper foil. This laminate thus prepared wassubjected to continuous thermal lamination with a lamination temperatureof 380° C., laminate pressure of 196N/cm (20 kgf/cm), and laminate rate1.5 m/min, by using a heat roll laminating apparatus. Thereby, aflexible metal-clad laminate according to the present invention wasobtained.

Example 2

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 1, except that the polyamic acid solution obtainedin Synthesis Example 2 was used instead of the polyamic acid solutionobtained in Synthesis Example 1.

Example 3

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 1, except that the polyamic acid solution obtainedin Synthesis Example 3 was used instead of the polyamic acid solutionobtained in Synthesis Example 1.

Example 4

After the polyamic acid solution obtained in Synthesis Example 7 wasdiluted with DMF to a solid content of 14 wt %, an imidizationaccelerator was added to the diluted polyamic acid solution by 50%weight ratio, the imidization accelerator containing aceticanhydride/isoquinoline/DMF (at a weight ratio of 1.0/0.3/4.0). Then, thediluted polyamic acid solution was applied on both sides of aheat-resistant polyimide film (Apical 17FP, Kaneka Corp, waterabsorption coefficient 1.4%) of 17 μm thickness, so as to make athermoplastic polyimide layer (to be an adhesive layer) of 4 μm finalthickness on each side. Then, a laminate thus prepared was heated at140° C. for 1 minute. Then, the laminate was subjected to heat treatmentof 250° C. for 10 seconds, 350° C. for 10 seconds, 450° C. for 10seconds, 350° C. for 5 seconds, and then 250° C. for 5 seconds forimidization, thereby obtaining a film.

On each side of the film thus prepared, a rolled copper foil of 18 μmthickness (BHY-22B-T; Nippon Mining & Metals Co. Ltd.) was provided.Then, a protective material (Apical 125NPI; Kanaka Corp.) was providedon the top of each copper foil. This laminate thus prepared wassubjected to continuous thermal lamination with a lamination temperatureof 340° C., laminate pressure of 196N/cm (20 kgf/cm), and laminate rate1.5 m/min, by using a heat roll laminating apparatus. Thereby, aflexible metal-clad laminate according to the present invention wasobtained.

Example 5

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 4, except that the polyamic acid solution obtainedin Synthesis Example 8 was used instead of the polyamic acid solutionobtained in Synthesis Example 7.

Example 6

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 4, except that the polyamic acid solution obtainedin Synthesis Example 9 was used instead of the polyamic acid solutionobtained in Synthesis Example 7.

Example 7

To the polyamic acid solution obtained in Synthesis Example 11, animidization accelerator containing acetic anhydride/isoquinoline/DMF (ata weight ratio of 2.0/0.3/4.0) was added by 45% weight ratio. A mixturethus prepared was stirred with a mixer, thereby obtaining a dopesolution 1. Meanwhile, the polyamic acid solution obtained in SynthesisExample 1 was diluted with DMF to 300 poise, thereby obtaining a dopesolution 2. The dope solutions 1 and 2 were co-extruded via athree-layer die so as to extrude the dope solution 2 on top of bothsides of the dope solution 1. The extruded dope solutions 1 and 2 wereflow-cast onto an endless belt made of stainless steel, therebyobtaining a flow-cast film was heated at 130° C. for 100 seconds. Then,a self-supporting gel film (volatile content: 30 wt %) thus prepared waspeeled off from the endless belt and Centered. Then, the gel film wassubjected to heat treatment of 250° C. for 10 seconds, 350° C. for 10seconds, and then 450° C. for 15 seconds for drying and imidization,thereby obtaining a film of 14 μm thickness. The film was treated in thesame manner as in Example 1, so as to obtain a flexible metal-cladlaminate.

Comparative Example 1

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 1, except that the polyamic acid solution obtainedin Synthesis Example 4 was used instead of the polyamic acid solutionobtained in Synthesis Example 1.

Comparative Example 2

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 1, except that the polyamic acid solution obtainedin Synthesis Example 5 was used instead of the polyamic acid solutionobtained in Synthesis Example 1.

Comparative Example 3

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 1, except that the polyamic acid solution obtainedin Synthesis Example 6 was used instead of the polyamic acid solutionobtained in Synthesis Example 1. The flexible metal-clad laminate, whosecopper foil was easily peeled off, was not evaluated in terms ofpost-moisture absorption solderability.

Comparative Example 4

A film and a flexible metal-clad laminate were obtained in the samemanner as in Example 4, except that the polyamic acid solution obtainedin Synthesis Example 10 was used instead of the polyamic acid solutionobtained in Synthesis Example 7.

In Tables 1 and 2, melting points (T and glass transition temperature(Tg) of the thermal plastic polyimides used for the adhesive layers ofthe films, and properties of the flexible metal-clad laminates obtainedin the Examples and Comparative Examples are shown.

TABLE 1 Post-Moisture Metal Foil Absorption Peeling Tg Tm SolderabilityStrength (° C.) (° C.) 250° C. 270° C. 300° C. (N/cm) Ex. 1 230 400 goodgood good 14 Ex. 2 211 392 good good good 15 Ex. 3 210 395 good goodgood 15 Ex. 4 205 371 good good good 13 Ex. 5 205 373 good good good 14Ex. 6 200 368 good good good 15 Ex. 7 230 400 good good good 16 Com. Ex.1 270 — good good poor 13 Com. Ex. 2 240 — good poor poor 12 Com. Ex. 3285 — — — — — Com. Ex. 4 200 Broad good poor poor 10 Abbreviation: “Ex.”stands for Example. “Com. Ex.” stands for Comparative Example.

TABLE 2 Absolute Value Absolute Value of Peak Area of Peak Area beforemetal after metal foil bonding foil bonding (mJ/mg) (mJ/mg) EPR EPM EPREPM Ex. 1 2.4 8.5 0.0 8.0 Ex. 2 1.8 8.0 0.0 7.8 Ex. 3 2.0 8.5 0.0 8.0Ex. 4 1.7 5.0 0.1 6.5 Ex. 5 2.0 5.0 0.1 6.5 Ex. 6 1.5 5.5 0.1 6.0 Ex. 70.2 6.5 0.0 6.0 Com. Ex. 1 — — — — Com. Ex. 2 — — — — Com. Ex. 3 — — — —Com. Ex. 4 4.5 Broad 4.5 Broad Abbreviation: “Ex.” stands for Example.“Com. Ex.” stands for Comparative Example. “EPR” stands for ExothermicPeak due to Recrystallization. “EPM” stands for Endothermic Peak due toMelting.

As shown in the Comparative Examples, the flexible metal-clad laminateseach comprising a film whose adhesive layer was prepared from anon-crystalline thermoplastic polyimide showed better post-moistureabsorption solderability with higher glass transition temperature of theadhesive layer. However, the adhesion with respect to the metal foil wasimpractically poor in the flexible metal-clad laminates with anexcessively high glass transition temperature.

Meanwhile, the Examples in each of which a film whose adhesive layer wasprepared from a crystalline thermoplastic polyimide showed glasstransition temperatures lower than those provided by the non-crystallinethermoplastic polyimide. However, the Examples showed excellentpost-moisture absorption solderability together with sufficientmetal-foil peeling strength (i.e., the adhesion between the metal foiland the film).

Moreover, compared with Examples 1 to 3, Examples 4 to 6 in which aparticular polymerization method was used for the polymerization of thethermoplastic polyimide precursors showed melting points lower by 20° C.to 25° C., and excellent post-moisture absorption solderability andmetal-foil peeling strength even though the lamination was carried outwith such a low temperature of 340° C. Thus, Examples 4 to 6 wereimproved in processability without sacrificing the properties.

This result overturns the conventional knowledge that “comprising a filmwith an adhesive layer of a higher glass transition temperature improvesthe post-moisture absorption solderability but inevitably deterioratesthe processability in exchange”. The present invention is expected to beapplicable to fields where higher post-moisture absorption solderabilityis required.

1. A film comprising an adhesive layer on at least one side surface of aheat-resistant polyimide film, the adhesive layer containing athermoplastic polyimide, the thermoplastic polyimide being a crystallinethermoplastic polyimide, the film being such that an absolute value ofan endothermic peak area attributed to melting of the crystallinethermoplastic polyimide is 4.0 mJ/mg or higher, the endothermic peakarea being measured by performing a differential scanning calorimetry onthe film.
 2. The film according to claim 1, wherein an absolute value ofan exothermic peak area attributed to recrystallization of thecrystalline thermoplastic polyimide is 4.0 mJ/mg or lower, theexothermic peak area being measured by performing the differentialscanning calorimetry on the film.
 3. The film according to claim 1,wherein the thermoplastic polyimide has a melting point within a rangeof 340° C. to 450° C.
 4. The film according to claim 1, wherein a waterabsorption coefficient of the heat-resistant polyimide film is 1.5% orlower.
 5. The film according to claim 1, wherein the crystallinethermoplastic polyimide is obtainable by imidizing a polyamic acidcomposed from a combination of a diamine component and a dianhydridecomponent, the diamine component being selected from the groupconsisting of 1,4-bis(4-aminophenoxy)benzene;1,3-bis(4-aminophenoxy)benzene; 4,4′-bis(3-aminophenoxy)biphenyl;4,4′-bis(4-aminophenoxy)biphenyl; 1,4-diaminobenzene; and3,4′-diaminodiphenyl ether, the dianhydride component being selectedfrom the group consisting of pyromellitic dianhydride;3,3′,4,4′-biphenyl tetra carboxylic dianhydride; and3,3′,4,4′-benzophenone tetra carboxylic dianhydride.
 6. The filmaccording to claim 1, wherein the crystalline thermoplastic polyimide iscontained in an amount of 85 wt % to 100 wt % with respect to thethermoplastic polyimide contained in the adhesive layer.
 7. The filmaccording to claim 1, wherein the crystalline thermoplastic polyimide isobtainable by imidizing a polyamic acid obtained through the followingsteps (a) to (c): (a) a step for obtaining a prepolymer having an aminogroup or an acid anhydride group at both ends by reacting an aromaticdiamine with an aromatic dianhydride in an organic polar solvent under acondition where the aromatic diamine or the aromatic dianhydride iscontained in excess; (b) a step for further adding (i) an aromaticdiamine having a different structure from the aromatic diamine used in(a) or (ii) an aromatic dianhydride having a different structure fromthe aromatic dianhydride used in (a); and (c) a step for further adding(i) the aromatic diamine having the different structure from thearomatic diamine used in (a) or (ii) the aromatic dianhydride having thedifferent structure from the aromatic dianhydride used in (a) so thatthe aromatic diamine and the aromatic dianhydride are contained in asubstantially equimolar amount throughout all steps and then performingpolymerization.
 8. The film according to claim 7, wherein thecrystalline thermoplastic polyimide is obtainable by imidizing apolyamic acid obtained through the following steps (a) to (c): (a) astep for obtaining a prepolymer having amino groups at both ends byreacting the aromatic diamine with the aromatic dianhydride in theorganic polar solvent under a condition where the aromatic diamine iscontained in excess; (b) a step for further adding the aromatic diaminehaving a different structure from the aromatic diamine used in (a); and(c) a step for further adding the aromatic dianhydride having adifferent structure from the aromatic dianhydride used in (a) so thatthe aromatic diamine and the aromatic dianhydride are contained in asubstantially equimolar amount throughout all steps and then performingpolymerization.
 9. The film according to claim 7, wherein thecrystalline thermoplastic polyimide is obtainable by imidizing apolyamic acid obtained through the following steps (a) to (c): (a) astep for obtaining a prepolymer having acid anhydride groups at bothends by reacting the aromatic diamine with the aromatic dianhydride inthe organic polar solvent under a condition where the aromaticdianhydride is contained in excess; (b) a step for further adding anaromatic dianhydride having a different structure from the aromaticdianhydride used in (a); and (c) a step for further adding the aromaticdiamine having a different structure from the aromatic diamine used in(a) so that the aromatic diamine and the aromatic dianhydride arecontained in a substantially equimolar amount throughout all steps andthen performing polymerization.
 10. The film according to claim 7,wherein the crystalline thermoplastic polyimide contained in theadhesive layer has a melting point at least 5° C. lower than acrystalline thermoplastic polyimide obtainable by imidizing (i) apolyamic acid obtained through a polymerization performed so that thearomatic diamine used in the step (a) and the aromatic dianhydride usedin the step (a) are contained in a substantially equimolar amount or(ii) a polyamic acid obtained through a polymerization performed so thatthe aromatic diamine used in the steps (b) and (c) and the aromaticdianhydride used in the steps (b) and (c) are contained in asubstantially equimolar amount.
 11. The film according to claim 7,wherein the crystalline thermoplastic polyimide has a melting pointwithin a range of 340° C. to 380° C.
 12. A flexible metal-clad laminatecomprising a film as set forth in claim 1 and a metal layer formed on atleast one side surface of the film.
 13. The flexible metal-clad laminateaccording to claim 12, which meets both of the following conditions (i)and (ii): (i) a peeling strength for the metal layer is 10 N/cm orgreater, where a force to peel the metal layer is applied in a 180degrees direction; and (ii) defective appearance such as swelling andwhitening does not occur even if being exposed under a moisturecondition of 40° C. of temperature and 90% R.H. for 96 hours andthereafter immersed in solder dip of 300° C. for 10 seconds.
 14. Theflexible metal-clad laminates according to claim 12, wherein the filmresulting from removal of the metal layer provided on the film byetching etc. is such that (i) an absolute value of an endothermic peakarea attributed to melting of the crystalline thermoplastic polyimide is4.0 mJ/mg or higher, the endothermic peak area being measured byperforming a differential scanning calorimetry on the film, and (ii) anabsolute value of an exothermic peak area attributed torecrystallization of the crystalline thermoplastic polyimide is 0.5mJ/mg or lower, the exothermic peak area being measured by performingthe differential scanning calorimetry on the film.